웨이퍼 접합 시험에서의 파괴역학적 응용 연구An application of fracture mechanics to wafer bonding test
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 엄윤용 | - |
| dc.contributor.advisor | Earmme, Youn-Young | - |
| dc.contributor.author | 문호정 | - |
| dc.contributor.author | Moon, Ho-Jeong | - |
| dc.date.accessioned | 2011-12-14T05:16:22Z | - |
| dc.date.available | 2011-12-14T05:16:22Z | - |
| dc.date.issued | 1998 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=143405&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/42913 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 기계공학과, 1998.8, [ ix, 108 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 블레이드 시험 | - |
| dc.subject | T-응력 | - |
| dc.subject | 양극 접합 | - |
| dc.subject | 웨이퍼 접합 | - |
| dc.subject | 계면파괴인성치 | - |
| dc.subject | Interfacial fracture toughness | - |
| dc.subject | Blade test | - |
| dc.subject | T-stress | - |
| dc.subject | Anodic bonding | - |
| dc.subject | Wafer bonding | - |
| dc.title | 웨이퍼 접합 시험에서의 파괴역학적 응용 연구 | - |
| dc.title.alternative | An application of fracture mechanics to wafer bonding test | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 143405/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학과, | - |
| dc.identifier.uid | 000925118 | - |
| dc.contributor.localauthor | 엄윤용 | - |
| dc.contributor.localauthor | Earmme, Youn-Young | - |
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- ME-Theses_Ph.D.(박사논문)
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