학위논문(박사) - 한국과학기술원 : 산업공학과, 2008. 8., [ vii, 89 p. ]
multip-chip package; reentrant; assembly; parallel machines; scheduling; 멀티칩 패키지; 재방문; 조립; 병렬설비; 일정계획; multip-chip package; reentrant; assembly; parallel machines; scheduling; 멀티칩 패키지; 재방문; 조립; 병렬설비; 일정계획
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