양극 산화된 알루미늄 기판 기반의 박막 MCM-D를 이용한 분산증폭기의 설계 및 제작Design and fabrication of distributed amplifier using thin film MCM-D based on anodized aluminum substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 권영세 | - |
| dc.contributor.advisor | Kwon, Young-Se | - |
| dc.contributor.author | 손보인 | - |
| dc.contributor.author | Sohn, Bo-In | - |
| dc.date.accessioned | 2011-12-14T02:04:55Z | - |
| dc.date.available | 2011-12-14T02:04:55Z | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=268864&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/38518 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2007. 8, [ viii, 61 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 분산증폭기 | - |
| dc.subject | 멀티칩모듈 | - |
| dc.subject | 알루미늄 | - |
| dc.subject | distributed amplifier,multichip module | - |
| dc.subject | MCM-D | - |
| dc.subject | Aluminum | - |
| dc.subject | 분산증폭기 | - |
| dc.subject | 멀티칩모듈 | - |
| dc.subject | 알루미늄 | - |
| dc.subject | distributed amplifier,multichip module | - |
| dc.subject | MCM-D | - |
| dc.subject | Aluminum | - |
| dc.title | 양극 산화된 알루미늄 기판 기반의 박막 MCM-D를 이용한 분산증폭기의 설계 및 제작 | - |
| dc.title.alternative | Design and fabrication of distributed amplifier using thin film MCM-D based on anodized aluminum substrate | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 268864/325007 | - |
| dc.description.department | 한국과학기술원 : 전기및전자공학전공, | - |
| dc.identifier.uid | 020053280 | - |
| dc.contributor.localauthor | 권영세 | - |
| dc.contributor.localauthor | Kwon, Young-Se | - |
- Appears in Collection
- EE-Theses_Master(석사논문)
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