플립 칩 본딩으로 패키징한 레이저 다이오우드 어레이에서의 열적 특성 변화 분석Analysis of thermal characteristic variation in LD arrays packaged by flip-chip solder bump bonding technique
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 신상영 | - |
| dc.contributor.advisor | Shin, Sang-Yung | - |
| dc.contributor.author | 서종화 | - |
| dc.contributor.author | Seo, Chong-Hwa | - |
| dc.date.accessioned | 2011-12-14T02:01:05Z | - |
| dc.date.available | 2011-12-14T02:01:05Z | - |
| dc.date.issued | 1995 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=99262&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/38272 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 1995.2, [ [ii], 59 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.title | 플립 칩 본딩으로 패키징한 레이저 다이오우드 어레이에서의 열적 특성 변화 분석 | - |
| dc.title.alternative | Analysis of thermal characteristic variation in LD arrays packaged by flip-chip solder bump bonding technique | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 99262/325007 | - |
| dc.description.department | 한국과학기술원 : 전기및전자공학과, | - |
| dc.identifier.uid | 000933242 | - |
| dc.contributor.localauthor | 신상영 | - |
| dc.contributor.localauthor | Shin, Sang-Yung | - |
- Appears in Collection
- EE-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.