학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2006.2, [ xii, 66 p. ]
Package/Board Co-Simulation; Package/Board Co-Design; Segmentation Method; Hierarchical Power/Ground Network; Inter-plane Effect; 연계 시뮬레이션; 연계 설계; 구조 분할 방법; 계층적 전력 접지망; Fringing Effect
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