Analysis and measurement of simultaneous switching noise coupling to signal trace and via in multi-layer package and PCB

Abstract

Recently, the signal bandwidth of digital system for high performance has been increased up to several Gbps and routing density in system board has been increased. Because of those reasons, system needs multi-layer package and PCB. Furthermore, as the clock frequency and power consumption of high speed digital system increase, large amount of simultaneous switching noise (SSN) are generated. The generated SSN causes performance degradation, timing delay, skew and EMI. Also, SSN is coupled to signal line routed in multi-layer package and PCB and makes noise margin of signal decrease. This paper thoroughly investigated noise coupling mechanisms to signal from power/ground SSN and verified through modeling and measurement for manufactured 6-layer test PCB. Moreover, this paper suggests proper line position as an alternative solution to reduce SSN coupling to signal.