기판접착을 이용한 몸체접지형SOI nMOSFET에 대한 연구 = Study on grounded body SOI n-channel MOSFET by wafer bonding

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Advisors
이귀로researcherLee, Kwy-Roresearcher
Description
한국과학기술원 : 전기 및 전자공학과,
Publisher
한국과학기술원
Issue Date
1996
Identifier
106106/325007 / 000855009
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 전기 및 전자공학과, 1996.2, [ viii, 93 p. ]

Keywords

모스소자; 기팝접착; 에스오아이; 몸체접지; Grounded Body; MOSFET; Wafer Bonding; SOI

URI
http://hdl.handle.net/10203/36309
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=106106&flag=dissertation
Appears in Collection
EE-Theses_Ph.D.(박사논문)
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