DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 김경민 | - |
dc.contributor.author | Park, Juseong | - |
dc.contributor.author | 박주성 | - |
dc.date.accessioned | 2024-08-08T19:31:24Z | - |
dc.date.available | 2024-08-08T19:31:24Z | - |
dc.date.issued | 2024 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=1099319&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/322100 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2024.2,[v, 88 p. :] | - |
dc.description.abstract | In order to miniaturize chips and process big data, research on 2.5D/3D packaging to realize light, thin and compact semiconductor devices is being actively conducted. This can be realized through High Bandwidth Memory (HBM), which dramatically increases the bandwidth of stacked memory devices using Through Silicon Vias (TSV) bonded by micro-bump inside the chip. Currently, Sn/Ag solder is used for stable bonding due to a low melting point, but it is difficult to secure an ultra-fine pitch of less than 10 μm due to the bridging effect and side wall wetting. To solve this problem, Cu direct bonding technology through Direct Bond Interconnect (DBI) using SiO2 is being developed. However, SiO2-SiO2 bonding has a low adhesion strength compared to the existing polymer-based bonding, and is highly dependent on the process temperature and time Therefore, in this study, we conducted a systematic study on polymer-based Cu bonding technology with high reliability. We analyzed the material properties of benzocyclobutene (BCB) and successfully performed Cu direct bonding through an optimized chemical mechanical polishing (CMP) process. In conclusion, we were able to improve structural stability by developing a Cu/polymer hybrid CMP process and high-reliability Cu-Cu bonding technology. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | 패키징▼aTSV▼a구리직접접합▼a고분자▼a기계화학적연마▼a벤조사이클로부틴▼a아르곤 플라즈마▼a열압착 접합 | - |
dc.subject | Packaging▼aThrough silicon vias(TSV)▼aCu direct bonding▼aPolymer▼aChemical mechanical polishing (CMP)▼aBenzocyclobutene (BCB)▼aAr plasma▼aThermo-compressive bonding | - |
dc.title | Study on the copper/polymer hybrid bonding using benzocyclobutene (BCB) polymer with chemical mechanical polishing (CMP) method | - |
dc.title.alternative | 벤조사이클로부텐 폴리머를 활용한 기계화학적 연마 기반 구리/폴리머 하이브리드 접합 공정 기술에 관한 연구 | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :신소재공학과, | - |
dc.contributor.alternativeauthor | Kim, Kyung Min | - |
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