DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 배병수 | - |
dc.contributor.author | Lee, Jae Kyeong | - |
dc.contributor.author | 이재경 | - |
dc.date.accessioned | 2024-07-30T19:31:15Z | - |
dc.date.available | 2024-07-30T19:31:15Z | - |
dc.date.issued | 2024 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=1096752&flag=dissertation | en_US |
dc.identifier.uri | http://hdl.handle.net/10203/321534 | - |
dc.description | 학위논문(석사) - 한국과학기술원 : 신소재공학과, 2024.2,[vii, 86 p. :] | - |
dc.description.abstract | Recently, as internet usage and traffic volume continuously increase, there is a need for wireless telecommunication technology capable of rapidly processing it. Accordingly, high-frequency based 5G telecommunication technology, with its ultra-high speed, ultra-low latency, and ultra-connectivity, is drawing attention as a major technology for the fourth industrial revolution, represented by augmented reality (AR), virtual reality (VR) and autonomous vehicles. In addition to wireless telecommunication, high performance computing (HPC) for solving complex problems is also attracted a lot of attention. Similar to 5G telecommunication, this device also uses high-frequency based high-memory data bandwidth signal transmission. However, in such high-frequency wave range, dielectric loss becomes larger so that increased total transmission loss may lead to a degradation of performance. In order to prevent this degradation of performance, low dielectric loss materials should be applied as dielectric layers in microwave electronic devices by reducing dielectric loss. In this research, a novel vinyl-phenyl siloxane material and quartz fabric reinforced vinyl-phenyl siloxane film were fabricated with low dielectric constant and dissipation factor values in the GHz frequency wave range. High viscosity siloxane was mixed with a solvent and dried to create a non-sticky film at room temperature, providing a build-up film which is favorable for making high density interconnect (HDI) circuit boards. In addition to dielectric properties, water absorption property, mechanical and thermomechanical properties were measured to evaluate the actual applicability of the material. | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | 5G 통신기술▼a고주파▼a전송손실▼a유전손실▼a유전율▼a유전정접▼a실록산 유전체▼a빌드업 필름 | - |
dc.subject | 5G telecommunication technology▼aHigh frequency▼aTransmission loss▼aDielectric loss▼aDielectric constant▼aDissipation factor▼aSiloxane dielectric material▼aBuild-up film | - |
dc.title | High viscosity and low dielectric loss vinyl-phenyl siloxane material for fabrication of microwave electronic build-up film | - |
dc.title.alternative | 마이크로파 전자 소자 빌드업 필름 제조를 위한 고점도 저유전손실 비닐-페닐 실록산 소재 | - |
dc.type | Thesis(Master) | - |
dc.identifier.CNRN | 325007 | - |
dc.description.department | 한국과학기술원 :신소재공학과, | - |
dc.contributor.alternativeauthor | Bae, Byeong-Soo | - |
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