학위논문(석사) - 한국과학기술원 : 신소재공학과, 2024.2,[v, 58 p. :]
차세대 반도체 패키지▼a방열 기술▼a에폭시 몰딩 컴파운드▼a열전도도▼a열확산도▼a시그모이드 곡선 반응▼a폴리머-필러 시스템▼a힐-랭뮤어 방정식; Next-generation semiconductor package▼aThermal dissipation▼aEpoxy molding compound (EMC)▼aThermal conductivity▼aThermal diffusivity▼aSigmoidal curve response▼aPolymer-filler system▼aHill-langmuir equation
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