DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Sanghyeon | ko |
dc.contributor.author | Kim, Seong Kwang | ko |
dc.date.accessioned | 2024-05-30T10:00:51Z | - |
dc.date.available | 2024-05-30T10:00:51Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/319574 | - |
dc.description.abstract | Various embodiments relate to a stackable 3D artificial neural network device and a manufacturing method thereof. According to various embodiments, a device is manufactured to include a substrate, a neuron block placed on some areas on one side of the substrate, a synapse block placed on the rest of the areas on one side of the substrate, and the neuron block and the synapse block may include at least one first channel element arranged on one side of the substrate and at least one second channel element stacked on the first channel element. | - |
dc.title | Stackable 3D artificial neural network device and manufacturing method thereof | - |
dc.title.alternative | 적층형 3D 인공 신경망 디바이스 및 그의 제조 방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Kim, Sanghyeon | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 17114711 | - |
dc.identifier.patentRegistrationNumber | 11862647 | - |
dc.date.application | 2020-12-08 | - |
dc.date.registration | 2024-01-02 | - |
dc.publisher.country | US | - |
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