Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ju, Min Sang | ko |
| dc.contributor.author | Kim, Junmo | ko |
| dc.contributor.author | Gu, Chang-Yeon | ko |
| dc.contributor.author | Song, Myoung | ko |
| dc.contributor.author | Ma, Sung Woo | ko |
| dc.contributor.author | Lee, Jin Hee | ko |
| dc.contributor.author | Lee, Woong-Sun | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2024-01-05T02:00:34Z | - |
| dc.date.available | 2024-01-05T02:00:34Z | - |
| dc.date.created | 2024-01-02 | - |
| dc.date.issued | 2023-10-27 | - |
| dc.identifier.citation | The 21st International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317412 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 21st International Symposium on Microelectronics and Packaging (ISMP) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Paradise Hotel Busan | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Ju, Min Sang | - |
| dc.contributor.nonIdAuthor | Ma, Sung Woo | - |
| dc.contributor.nonIdAuthor | Lee, Jin Hee | - |
| dc.contributor.nonIdAuthor | Lee, Woong-Sun | - |
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