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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Temperature-Dependent Elastic Properties of Thin Molded Underfill

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김준모 / 구창연 / 송명 / 마성우 / 이진희 / 이웅선 / 김택수researcher
Publisher
한국마이크로전자 및 패키징학회
Issue Date
2023-04-06
Language
English
Citation

한국마이크로전자 및 패키징 학회 2023년도 춘계 정기학술대회

URI
http://hdl.handle.net/10203/317408
Appears in Collection
ME-Conference Papers(학술회의논문)
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