Self-pressure regulating CMP process for hybrid Cu/polymer bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kang, Sukkyung | ko |
| dc.contributor.author | Park, Juseong | ko |
| dc.contributor.author | Kim, Kyung Min | ko |
| dc.contributor.author | Kim, Sanha | ko |
| dc.date.accessioned | 2024-01-03T01:03:41Z | - |
| dc.date.available | 2024-01-03T01:03:41Z | - |
| dc.date.created | 2023-12-29 | - |
| dc.date.issued | 2023-04-05 | - |
| dc.identifier.citation | 3rd Korea-Tribology International Symposium, K-TRIB2023 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317252 | - |
| dc.language | English | - |
| dc.publisher | Korean Tribology Society | - |
| dc.title | Self-pressure regulating CMP process for hybrid Cu/polymer bonding | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 3rd Korea-Tribology International Symposium, K-TRIB2023 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | BEXCO, Busan | - |
| dc.contributor.localauthor | Kim, Kyung Min | - |
| dc.contributor.localauthor | Kim, Sanha | - |
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