Measurement of thin film adhesion by single cantilever beam method equipped with adjustable jig

Abstract

A new method to measure the tensile adhesion of thin film was proposed. A single cantilever beam method was used and an efficient adjustable jig was designed to minimize errors induced by misalignment of specimen. Applied load and displacement were recorded by data acquisition system. The dimensions of the specimen and conditions of test were preexamined by finite element analysis. Developed method was applied to measure the adhesion of thin film adhesive. Test results were independent of initial deviation of specimen alignment and showed consistent value with respect to crack length. Compared with shear test method, it was shown that the shear adhesion included the effect of thickness of adhesive, however, tensile adhesion was independent of the thickness of adhesive.