Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.contributor.author | Park, Jae-Hyeong | ko |
| dc.date.accessioned | 2023-10-13T07:01:34Z | - |
| dc.date.available | 2023-10-13T07:01:34Z | - |
| dc.identifier.uri | http://hdl.handle.net/10203/313327 | - |
| dc.description.abstract | Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin. | - |
| dc.title | Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same | - |
| dc.title.alternative | 솔더 도전 입자와 플럭스 첨가제를 함유하는 열압착 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법 | - |
| dc.type | Patent | - |
| dc.type.rims | PAT | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.assignee | KAIST | - |
| dc.identifier.iprsType | 특허 | - |
| dc.identifier.patentApplicationNumber | 16951466 | - |
| dc.identifier.patentRegistrationNumber | 11732162 | - |
| dc.date.application | 2020-11-18 | - |
| dc.date.registration | 2023-08-22 | - |
| dc.publisher.country | US | - |
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