DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Junyong | ko |
dc.contributor.author | Kim, Hyesoo | ko |
dc.contributor.author | Kim, Youngwoo | ko |
dc.contributor.author | Kim, Jonghoon J | ko |
dc.contributor.author | Bae, Bumhee | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Ha, Dongho | ko |
dc.contributor.author | Bae, Michael | ko |
dc.date.accessioned | 2023-10-06T06:01:59Z | - |
dc.date.available | 2023-10-06T06:01:59Z | - |
dc.date.created | 2023-10-06 | - |
dc.date.issued | 2015-12 | - |
dc.identifier.citation | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57 | - |
dc.identifier.uri | http://hdl.handle.net/10203/313073 | - |
dc.description.abstract | In this paper, structural and electrical characteristic deviations of silicone rubber sockets are analyzed depending on external force based on its lumped RLGC model. Electrical performances heavily depend on compression rate of the silicone rubber socket. Thus, study on the structural and electrical characteristic deviations of the silicone rubber socket depending on external force is needed for reliable tests. The deviations are analyzed based on an assumption based simplified equivalent model of the silicone rubber socket. For verification, a 3D electromagnetic (EM) simulation program is used and its results are compared with that of proposed RLGC models in the frequency domain. The electrical performance of the RLGC model is nearly identical to that of 3D EM simulation result. In addition, the electrical performance of the compressed silicone rubber socket is also nearly identical to that of a solder ball when it is compressed at different compression ratio. | - |
dc.language | English | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-84963811689 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 54 | - |
dc.citation.endingpage | 57 | - |
dc.citation.publicationname | IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Seoul | - |
dc.identifier.doi | 10.1109/EDAPS.2015.7383666 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Hyesoo | - |
dc.contributor.nonIdAuthor | Kim, Youngwoo | - |
dc.contributor.nonIdAuthor | Ha, Dongho | - |
dc.contributor.nonIdAuthor | Bae, Michael | - |
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