Analysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket

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dc.contributor.authorPark, Junyongko
dc.contributor.authorKim, Hyesooko
dc.contributor.authorKim, Youngwooko
dc.contributor.authorKim, Jonghoon Jko
dc.contributor.authorBae, Bumheeko
dc.contributor.authorKim, Jounghoko
dc.contributor.authorHa, Donghoko
dc.contributor.authorBae, Michaelko
dc.date.accessioned2023-10-06T06:01:59Z-
dc.date.available2023-10-06T06:01:59Z-
dc.date.created2023-10-06-
dc.date.issued2015-12-
dc.identifier.citationIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.54 - 57-
dc.identifier.urihttp://hdl.handle.net/10203/313073-
dc.description.abstractIn this paper, structural and electrical characteristic deviations of silicone rubber sockets are analyzed depending on external force based on its lumped RLGC model. Electrical performances heavily depend on compression rate of the silicone rubber socket. Thus, study on the structural and electrical characteristic deviations of the silicone rubber socket depending on external force is needed for reliable tests. The deviations are analyzed based on an assumption based simplified equivalent model of the silicone rubber socket. For verification, a 3D electromagnetic (EM) simulation program is used and its results are compared with that of proposed RLGC models in the frequency domain. The electrical performance of the RLGC model is nearly identical to that of 3D EM simulation result. In addition, the electrical performance of the compressed silicone rubber socket is also nearly identical to that of a solder ball when it is compressed at different compression ratio.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleAnalysis of external force dependent lumped RLGC model of high-bandwidth and high-density silicone rubber socket-
dc.typeConference-
dc.identifier.scopusid2-s2.0-84963811689-
dc.type.rimsCONF-
dc.citation.beginningpage54-
dc.citation.endingpage57-
dc.citation.publicationnameIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationSeoul-
dc.identifier.doi10.1109/EDAPS.2015.7383666-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Hyesoo-
dc.contributor.nonIdAuthorKim, Youngwoo-
dc.contributor.nonIdAuthorHa, Dongho-
dc.contributor.nonIdAuthorBae, Michael-
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EE-Conference Papers(학술회의논문)
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