Signal integrity analysis of vertical dual port coaxial connector for automotive system
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Dong-Hyun | ko |
| dc.contributor.author | Lee, Hyunsuk | ko |
| dc.contributor.author | Kim, Hongseok | ko |
| dc.contributor.author | Kim, Jonghoon | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Park, Jung-Min | ko |
| dc.contributor.author | Kim, Ji-Min | ko |
| dc.contributor.author | Lee, Kyung-Nam | ko |
| dc.contributor.author | Woo, Jong-Hoon | ko |
| dc.contributor.author | Kwon, Hyeok-Cheol | ko |
| dc.contributor.author | Kim, Hoon | ko |
| dc.date.accessioned | 2023-08-28T08:02:09Z | - |
| dc.date.available | 2023-08-28T08:02:09Z | - |
| dc.date.created | 2023-07-06 | - |
| dc.date.issued | 2016-10 | - |
| dc.identifier.citation | 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167 | - |
| dc.identifier.issn | 2165-4107 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/311908 | - |
| dc.description.abstract | Different designs of vertical dual port coaxial connectors are proposed and analyzed using full wave 3D simulation tool up to 10 GHz. By inserting conducting grounds around the pins, the signal integrity of the vertical dual port coaxial cable connector is improved. The vertical dual port coaxial connector cable assembly can be used to reduce the printed circuit board space required for the connectors and reduce the total cost of coaxial connectors required for automotive system. | - |
| dc.language | English | - |
| dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
| dc.title | Signal integrity analysis of vertical dual port coaxial connector for automotive system | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000401698400038 | - |
| dc.identifier.scopusid | 2-s2.0-85015237660 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 165 | - |
| dc.citation.endingpage | 167 | - |
| dc.citation.publicationname | 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.identifier.doi | 10.1109/EPEPS.2016.7835442 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, Dong-Hyun | - |
| dc.contributor.nonIdAuthor | Lee, Hyunsuk | - |
| dc.contributor.nonIdAuthor | Kim, Hongseok | - |
| dc.contributor.nonIdAuthor | Kim, Jonghoon | - |
| dc.contributor.nonIdAuthor | Park, Jung-Min | - |
| dc.contributor.nonIdAuthor | Kim, Ji-Min | - |
| dc.contributor.nonIdAuthor | Lee, Kyung-Nam | - |
| dc.contributor.nonIdAuthor | Woo, Jong-Hoon | - |
| dc.contributor.nonIdAuthor | Kwon, Hyeok-Cheol | - |
| dc.contributor.nonIdAuthor | Kim, Hoon | - |
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.