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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Pb-free Solder Interconnects for Electronic Packaging and Their Nano-scale Application to Printed Electronics and Transparent Electrode: Viewpoint of Computational Materials Science

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dc.contributor.authorLee, Hyuck-Moko
dc.date.accessioned2023-08-10T07:01:16Z-
dc.date.available2023-08-10T07:01:16Z-
dc.date.created2023-05-23-
dc.date.issued2018-08-19-
dc.identifier.citationEurope-Korea Conference on Science and Technology, EKC2018-
dc.identifier.urihttp://hdl.handle.net/10203/311398-
dc.languageEnglish-
dc.publisherKOEAUK-
dc.titlePb-free Solder Interconnects for Electronic Packaging and Their Nano-scale Application to Printed Electronics and Transparent Electrode: Viewpoint of Computational Materials Science-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameEurope-Korea Conference on Science and Technology, EKC2018-
dc.identifier.conferencecountryUK-
dc.identifier.conferencelocationTechnology & Innovation Centre, Glasgow-
dc.contributor.localauthorLee, Hyuck-Mo-
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MS-Conference Papers(학술회의논문)
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