Pb-free Solder Interconnects for Electronic Packaging and Their Nano-scale Application to Printed Electronics and Transparent Electrode: Viewpoint of Computational Materials Science
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이혁모 | ko |
| dc.date.accessioned | 2023-08-10T02:01:42Z | - |
| dc.date.available | 2023-08-10T02:01:42Z | - |
| dc.date.created | 2023-05-23 | - |
| dc.date.issued | 2018-04 | - |
| dc.identifier.citation | 2018 대한금속재료학회 춘계 학술 대회 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/311381 | - |
| dc.language | English | - |
| dc.publisher | 대한금속재료학회 | - |
| dc.title | Pb-free Solder Interconnects for Electronic Packaging and Their Nano-scale Application to Printed Electronics and Transparent Electrode: Viewpoint of Computational Materials Science | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2018 대한금속재료학회 춘계 학술 대회 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 제주국제컨벤션센터 | - |
| dc.contributor.localauthor | 이혁모 | - |
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