Power/ground noise coupling comparison and analysis in silicon, organic and glass interposers

Abstract

In this paper, we compare and analyze power/ground noise coupling in silicon, organic and glass interposers. We first compare the power/ground noise coupling of each interposer by analyzing transfer impedances of power distribution networks (PDNs). Due to low loss of the organic and glass substrates, at certain frequencies, transfer impedances increase dramatically and. In order to analyze the effects of the power/ground noise propagation in the PDN and coupling to through via channel we induced clock signals to each interposer's aggressor through via channel with data rate corresponds to the PDN (1,0)/(0,1) resonance frequency to load the power/ground noises in the PDN. We monitored the coupled voltages in the PDNs and compared eye-diagrams of the victim through via channels. Due to the low loss of the glass substrate, glass interposers turned out to be most vulnerable to the power/ground noise. We suppressed PDN transfer impedance of the glass interposer using decoupling capacitors and electromagnetic band gap structure.