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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Interfacial Reaction Between 42Sn/58Si solder and Electroless Ni-p/Immersion Au UBM During Theraml Aging

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dc.contributor.authorCho, Moon Giko
dc.contributor.authorPaik, Kyung Wookko
dc.contributor.authorLee, Hyuck-Moko
dc.date.accessioned2023-07-19T08:01:02Z-
dc.date.available2023-07-19T08:01:02Z-
dc.date.created2023-05-23-
dc.date.issued2005-02-15-
dc.identifier.citation134th TMS Annual Meeting & Exhibition-
dc.identifier.urihttp://hdl.handle.net/10203/310668-
dc.languageEnglish-
dc.publisherTMS-
dc.titleInterfacial Reaction Between 42Sn/58Si solder and Electroless Ni-p/Immersion Au UBM During Theraml Aging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname134th TMS Annual Meeting & Exhibition-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Francisco, CA-
dc.contributor.localauthorLee, Hyuck-Mo-
dc.contributor.nonIdAuthorCho, Moon Gi-
dc.contributor.nonIdAuthorPaik, Kyung Wook-
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MS-Conference Papers(학술회의논문)
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