DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Moon Gi | ko |
dc.contributor.author | Paik, Kyung Wook | ko |
dc.contributor.author | Lee, Hyuck-Mo | ko |
dc.date.accessioned | 2023-07-19T08:01:02Z | - |
dc.date.available | 2023-07-19T08:01:02Z | - |
dc.date.created | 2023-05-23 | - |
dc.date.issued | 2005-02-15 | - |
dc.identifier.citation | 134th TMS Annual Meeting & Exhibition | - |
dc.identifier.uri | http://hdl.handle.net/10203/310668 | - |
dc.language | English | - |
dc.publisher | TMS | - |
dc.title | Interfacial Reaction Between 42Sn/58Si solder and Electroless Ni-p/Immersion Au UBM During Theraml Aging | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 134th TMS Annual Meeting & Exhibition | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Francisco, CA | - |
dc.contributor.localauthor | Lee, Hyuck-Mo | - |
dc.contributor.nonIdAuthor | Cho, Moon Gi | - |
dc.contributor.nonIdAuthor | Paik, Kyung Wook | - |
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