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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Fabric-based fine pitch interconnect technology using anisotropic conductive films(ACFs)

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dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2023-07-06T12:00:34Z-
dc.date.available2023-07-06T12:00:34Z-
dc.date.created2023-07-06-
dc.date.created2023-07-06-
dc.date.created2023-07-06-
dc.date.issued2017-02-
dc.identifier.citation2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017, pp.16-
dc.identifier.urihttp://hdl.handle.net/10203/310371-
dc.description.abstractDue to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs of wearable electronic products in near future. Wearable watches, glasses, wrist bands, shoes, and clothes have been recently introduced in the market.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleFabric-based fine pitch interconnect technology using anisotropic conductive films(ACFs)-
dc.typeConference-
dc.identifier.wosid000404249700016-
dc.identifier.scopusid2-s2.0-85015744298-
dc.type.rimsCONF-
dc.citation.beginningpage16-
dc.citation.publicationname2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationKauai-
dc.identifier.doi10.23919/LTB-3D.2017.7947412-
dc.contributor.localauthorPaik, Kyung-Wook-
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MS-Conference Papers(학술회의논문)
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