Noise coupling analysis method for an electronic safety and arming device (ESAD)

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dc.contributor.authorKang, Hyungminko
dc.contributor.authorKim, Subinko
dc.contributor.authorLho, Daehwanko
dc.contributor.authorPark, Hyunwookko
dc.contributor.authorSim, Boogyoko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2023-07-06T10:00:22Z-
dc.date.available2023-07-06T10:00:22Z-
dc.date.created2023-06-08-
dc.date.created2023-06-08-
dc.date.issued2019-12-
dc.identifier.citation2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019-
dc.identifier.issn2151-1225-
dc.identifier.urihttp://hdl.handle.net/10203/310361-
dc.description.abstractIn this paper, we propose a noise coupling analysis method for electronic safety and arming device (ESAD) based on a 3D-electromagnetic simulation. To analyze dominant noise coupling path in the ESAD, we propose two types of simulation methods. Theses method are based on electromagnetic field detection probes. First simulation method is to ground the target victim signal trace to the ground plane. The other method is to make the target victim signal path open circuit. Based on the proposed simulation methods, we can clarify dominant noise coupling path in the PCB of ESAD. For verification, we applied proposed simulation method on various case that can affect capacitive and inductive noise coupling in the PCB. When the dielectric constant and the conductivity of the PCB were changed, the conductivity only affected noise coupling at frequency range where inductive coupling was dominant, and the change of dielectric constant of PCB was affected at frequency range where capacitive coupling was dominant.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleNoise coupling analysis method for an electronic safety and arming device (ESAD)-
dc.typeConference-
dc.identifier.wosid000555483500030-
dc.identifier.scopusid2-s2.0-85085059098-
dc.type.rimsCONF-
dc.citation.publicationname2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019-
dc.identifier.conferencecountryCH-
dc.identifier.conferencelocationKaohsiung-
dc.identifier.doi10.1109/EDAPS47854.2019.9011669-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Subin-
dc.contributor.nonIdAuthorPark, Hyunwook-
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EE-Conference Papers(학술회의논문)
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