DC Field | Value | Language |
---|---|---|
dc.contributor.author | 배현민 | ko |
dc.contributor.author | 송하일 | ko |
dc.date.accessioned | 2023-05-12T06:06:07Z | - |
dc.date.available | 2023-05-12T06:06:07Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/306760 | - |
dc.description.abstract | According to one embodiment of the present invention, there is provided a connector for coupling a waveguide and a substrate. The connector comprises a first opening formed in a direction perpendicular to one side of the substrate and attached to one side of the substrate; a second opening to which a waveguide for signal transmission can be attached, the second opening being formed in a directionparallel to the longitudinal direction of the waveguide; and a signal guide portion connecting the first opening portion and the second opening portion and including a hollow portion surrounded by theconductive layer therein. | - |
dc.title | Connector for coupling waveguide and substrate | - |
dc.title.alternative | 도파관 및 보드를 연결하는 커넥터 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 배현민 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 201980024779.1 | - |
dc.identifier.patentRegistrationNumber | 111954954 | - |
dc.date.application | 2019-04-05 | - |
dc.date.registration | 2023-01-06 | - |
dc.publisher.country | CC | - |
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