We propose a higher-κ non-hysteric ferroelectric field-effect transistor (FEFET) using reversible domain wall displacement. By separately stimulating reversible and irreversible domain walls, whose concepts have been experimentally suggested recently, our HfZrOx-based FEFET showed remarkable performance as both a logic and a memory device. This was achieved by relatively low-temperature annealing, contributing to the formation of more reversible domain walls in the film. Finally, we demonstrated the feasibility of logic and memory co-integration by common fabrication process with complementary metal-oxide-semiconductor (CMOS) compatibility.