DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, Keeyoung | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Kim, SeongGuk | ko |
dc.contributor.author | Kim, Keunwoo | ko |
dc.contributor.author | Park, Hyunwook | ko |
dc.contributor.author | Shin, TaeIn | ko |
dc.contributor.author | Choi, Seonguk | ko |
dc.contributor.author | Park, Joonsang | ko |
dc.contributor.author | Kim, Minsu | ko |
dc.contributor.author | Kim, Haeyoen | ko |
dc.date.accessioned | 2023-02-03T00:00:22Z | - |
dc.date.available | 2023-02-03T00:00:22Z | - |
dc.date.created | 2023-01-25 | - |
dc.date.issued | 2022-04-07 | - |
dc.identifier.citation | DesignCon 2022 | - |
dc.identifier.uri | http://hdl.handle.net/10203/304981 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | DesignCon 2022 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Santa Clara Convention Center | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Minsu | - |
dc.contributor.nonIdAuthor | Kim, Haeyoen | - |
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