Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Hyunwook | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Park, Joonsang | ko |
| dc.contributor.author | Park, Gap Yeol | ko |
| dc.contributor.author | Lho, Daehwan | ko |
| dc.contributor.author | Sim, BooGyo | ko |
| dc.contributor.author | Kang, Hyungmin | ko |
| dc.contributor.author | Shin, TaeIn | ko |
| dc.contributor.author | Kim, SeongGuk | ko |
| dc.contributor.author | Choi, Seonguk | ko |
| dc.date.accessioned | 2023-02-02T02:03:11Z | - |
| dc.date.available | 2023-02-02T02:03:11Z | - |
| dc.date.created | 2023-01-25 | - |
| dc.date.issued | 2021-12-13 | - |
| dc.identifier.citation | IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 | - |
| dc.identifier.issn | 2151-1225 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/304940 | - |
| dc.description.abstract | In this paper, we propose the design of a high definition multimedia interface (HDMI) 2.1 connector considering signal integrity (SI) for improved electrical characteristics. We design the receptacle based on the analysis of electrical specification margins for 4 channels: D0, D1, D2, CK. The electrical characteristic includes insertion loss (IL), attenuation to crosstalk noise ratio (ACR) and time-domain reflectometry (TDR) impedance. Customized solutions for each channel are investigated considering their electrical performance margins respectively. As a result, we verify the SI performance improvement compared to the previous work through the 3D electromagnetic (EM) simulation. | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-85124167592 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Urbana | - |
| dc.identifier.doi | 10.1109/EDAPS53774.2021.9657005 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
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