A 50Gb/s PAM-4 Bi-Directional Plastic Waveguide Link with Carrier Synchronization Using PI-Based Costas Loop

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dc.contributor.authorSong, Ha-IIko
dc.contributor.authorChoi, Hanhoko
dc.contributor.authorYoo, Jun Youngko
dc.contributor.authorWon, Hyo-Supko
dc.contributor.authorLee, Cheong Minko
dc.contributor.authorJin, Huxianko
dc.contributor.authorKim, Tai Youngko
dc.contributor.authorKwon, Woohyunko
dc.contributor.authorLim, Kyoohyunko
dc.contributor.authorKwon, Konanko
dc.contributor.authorKim, Chang-Ahnko
dc.contributor.authorKim, Taehoko
dc.contributor.authorJo, Jun Giko
dc.contributor.authorEu, Jakeko
dc.contributor.authorPark, Seanko
dc.contributor.authorBae, Hyeon-Minko
dc.date.accessioned2022-11-17T05:00:57Z-
dc.date.available2022-11-17T05:00:57Z-
dc.date.created2022-09-27-
dc.date.issued2022-02-
dc.identifier.citation2022 IEEE International Solid-State Circuits Conference, ISSCC 2022, pp.126 - 128-
dc.identifier.issn0193-6530-
dc.identifier.urihttp://hdl.handle.net/10203/299784-
dc.description.abstractThe demand for greater I/O bandwidth in data centers is increasing due to the explosive growth of network traffic. However, conventional high-speed interconnects are struggling with the challenges in both functional and economical aspects. Copper-based electrical links are displaying their critical bandwidth limitation caused by skin loss. Optical links require significant capital expenses for the E/O and O/E conversion devices and the chip-to-fiber assembly in short-reach high-volume links. As an alternative, the recent studies present that the plastic waveguide links showing the inherent low-loss and wideband channel characteristics can be a promising solution to provide the power-/cost-efficient high-speed interconnects. However, prior arts have demonstrated only a single waveguide transmission due to the low confinement of the waveguide [1]-[4] and a limited carrier synchronization requiring external local oscillator (LO) phase tuning [2]-[4]. In this paper, we demonstrate a 1m 50Gb/s PAM-4 bi-directional plastic waveguide link with carrier synchronization using 70GHz transmitter (TX) and receiver (RX) ICs in fan-out wafer-level packaging (FOWLP) fabricated in 28nm CMOS. The link achieves an FoM of 2.8pJ/b/m showing state-of-the-art performance in terms of throughput-distance, and energy efficiency.-
dc.languageEnglish-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleA 50Gb/s PAM-4 Bi-Directional Plastic Waveguide Link with Carrier Synchronization Using PI-Based Costas Loop-
dc.typeConference-
dc.identifier.scopusid2-s2.0-85128336719-
dc.type.rimsCONF-
dc.citation.beginningpage126-
dc.citation.endingpage128-
dc.citation.publicationname2022 IEEE International Solid-State Circuits Conference, ISSCC 2022-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Francisco-
dc.identifier.doi10.1109/ISSCC42614.2022.9731707-
dc.contributor.localauthorBae, Hyeon-Min-
dc.contributor.nonIdAuthorSong, Ha-II-
dc.contributor.nonIdAuthorChoi, Hanho-
dc.contributor.nonIdAuthorYoo, Jun Young-
dc.contributor.nonIdAuthorWon, Hyo-Sup-
dc.contributor.nonIdAuthorLee, Cheong Min-
dc.contributor.nonIdAuthorJin, Huxian-
dc.contributor.nonIdAuthorKim, Tai Young-
dc.contributor.nonIdAuthorKwon, Woohyun-
dc.contributor.nonIdAuthorLim, Kyoohyun-
dc.contributor.nonIdAuthorKwon, Konan-
dc.contributor.nonIdAuthorKim, Chang-Ahn-
dc.contributor.nonIdAuthorKim, Taeho-
dc.contributor.nonIdAuthorJo, Jun Gi-
dc.contributor.nonIdAuthorEu, Jake-
dc.contributor.nonIdAuthorPark, Sean-
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