DC Field | Value | Language |
---|---|---|
dc.contributor.author | Song, Ha-II | ko |
dc.contributor.author | Choi, Hanho | ko |
dc.contributor.author | Yoo, Jun Young | ko |
dc.contributor.author | Won, Hyo-Sup | ko |
dc.contributor.author | Lee, Cheong Min | ko |
dc.contributor.author | Jin, Huxian | ko |
dc.contributor.author | Kim, Tai Young | ko |
dc.contributor.author | Kwon, Woohyun | ko |
dc.contributor.author | Lim, Kyoohyun | ko |
dc.contributor.author | Kwon, Konan | ko |
dc.contributor.author | Kim, Chang-Ahn | ko |
dc.contributor.author | Kim, Taeho | ko |
dc.contributor.author | Jo, Jun Gi | ko |
dc.contributor.author | Eu, Jake | ko |
dc.contributor.author | Park, Sean | ko |
dc.contributor.author | Bae, Hyeon-Min | ko |
dc.date.accessioned | 2022-11-17T05:00:57Z | - |
dc.date.available | 2022-11-17T05:00:57Z | - |
dc.date.created | 2022-09-27 | - |
dc.date.issued | 2022-02 | - |
dc.identifier.citation | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022, pp.126 - 128 | - |
dc.identifier.issn | 0193-6530 | - |
dc.identifier.uri | http://hdl.handle.net/10203/299784 | - |
dc.description.abstract | The demand for greater I/O bandwidth in data centers is increasing due to the explosive growth of network traffic. However, conventional high-speed interconnects are struggling with the challenges in both functional and economical aspects. Copper-based electrical links are displaying their critical bandwidth limitation caused by skin loss. Optical links require significant capital expenses for the E/O and O/E conversion devices and the chip-to-fiber assembly in short-reach high-volume links. As an alternative, the recent studies present that the plastic waveguide links showing the inherent low-loss and wideband channel characteristics can be a promising solution to provide the power-/cost-efficient high-speed interconnects. However, prior arts have demonstrated only a single waveguide transmission due to the low confinement of the waveguide [1]-[4] and a limited carrier synchronization requiring external local oscillator (LO) phase tuning [2]-[4]. In this paper, we demonstrate a 1m 50Gb/s PAM-4 bi-directional plastic waveguide link with carrier synchronization using 70GHz transmitter (TX) and receiver (RX) ICs in fan-out wafer-level packaging (FOWLP) fabricated in 28nm CMOS. The link achieves an FoM of 2.8pJ/b/m showing state-of-the-art performance in terms of throughput-distance, and energy efficiency. | - |
dc.language | English | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | A 50Gb/s PAM-4 Bi-Directional Plastic Waveguide Link with Carrier Synchronization Using PI-Based Costas Loop | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-85128336719 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 126 | - |
dc.citation.endingpage | 128 | - |
dc.citation.publicationname | 2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Francisco | - |
dc.identifier.doi | 10.1109/ISSCC42614.2022.9731707 | - |
dc.contributor.localauthor | Bae, Hyeon-Min | - |
dc.contributor.nonIdAuthor | Song, Ha-II | - |
dc.contributor.nonIdAuthor | Choi, Hanho | - |
dc.contributor.nonIdAuthor | Yoo, Jun Young | - |
dc.contributor.nonIdAuthor | Won, Hyo-Sup | - |
dc.contributor.nonIdAuthor | Lee, Cheong Min | - |
dc.contributor.nonIdAuthor | Jin, Huxian | - |
dc.contributor.nonIdAuthor | Kim, Tai Young | - |
dc.contributor.nonIdAuthor | Kwon, Woohyun | - |
dc.contributor.nonIdAuthor | Lim, Kyoohyun | - |
dc.contributor.nonIdAuthor | Kwon, Konan | - |
dc.contributor.nonIdAuthor | Kim, Chang-Ahn | - |
dc.contributor.nonIdAuthor | Kim, Taeho | - |
dc.contributor.nonIdAuthor | Jo, Jun Gi | - |
dc.contributor.nonIdAuthor | Eu, Jake | - |
dc.contributor.nonIdAuthor | Park, Sean | - |
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