CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE마이크로스트립 회로 및 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스

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Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
Assignee
KAIST
Country
IT (Italy)
Application Date
2017-10-02
Application Number
15884067.8
Registration Date
2021-11-03
Registration Number
3267528
URI
http://hdl.handle.net/10203/298643
Appears in Collection
EE-Patent(특허)
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