DC Field | Value | Language |
---|---|---|
dc.contributor.author | Im, Dongseok | ko |
dc.contributor.author | Park, Gwangtae | ko |
dc.contributor.author | Ryu, Junha | ko |
dc.contributor.author | Li, Zhiyong | ko |
dc.contributor.author | Kang, Sanghoon | ko |
dc.contributor.author | Han, Donghyeon | ko |
dc.contributor.author | Lee, Jinsu | ko |
dc.contributor.author | Park, Wonhoon | ko |
dc.contributor.author | Kwon, Hankyul | ko |
dc.contributor.author | Yoo, Hoi-Jun | ko |
dc.date.accessioned | 2022-09-05T02:01:35Z | - |
dc.date.available | 2022-09-05T02:01:35Z | - |
dc.date.created | 2022-09-01 | - |
dc.date.created | 2022-09-01 | - |
dc.date.issued | 2022-04 | - |
dc.identifier.citation | 25th IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) | - |
dc.identifier.issn | 2473-4683 | - |
dc.identifier.uri | http://hdl.handle.net/10203/298307 | - |
dc.description.abstract | A low-power and real-time 3D object recognition with RGBD data acquisition system-on-chip (SoC) is proposed. By synthesizing dense RGB-D data through monocular depth estimation, the proposed system reduces the sensor power for 3D data acquisition by x27.3 lower. Moreover, the proposed processor reduces the energy consumption of a point cloud based neural network (PNN) exploiting bit-slice-level computation and a point feature reuse method with a pipelined architecture. Additionally, the processor supports the point sampling and grouping algorithms of the PNN with a unified point processing core. Finally, the processor achieves 210.0 mW while implementing 34.0 frame-per-second (fps) end-to-end RGB-D acquisition and 3D object recognition. | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms | - |
dc.type | Conference | - |
dc.identifier.wosid | 000838698200001 | - |
dc.identifier.scopusid | 2-s2.0-85130847107 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 25th IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) | - |
dc.identifier.conferencecountry | JA | - |
dc.identifier.conferencelocation | Univ Tokyo, Tokyo | - |
dc.identifier.doi | 10.1109/COOLCHIPS54332.2022.9772667 | - |
dc.contributor.localauthor | Yoo, Hoi-Jun | - |
dc.contributor.nonIdAuthor | Lee, Jinsu | - |
dc.contributor.nonIdAuthor | Park, Wonhoon | - |
dc.contributor.nonIdAuthor | Kwon, Hankyul | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.