DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sung, Hyung Jin | ko |
dc.contributor.author | Park, Jinsoo | ko |
dc.contributor.author | Destgeer, Ghulam | ko |
dc.contributor.author | Cho, Yeunwoo | ko |
dc.contributor.author | Kim, Hyoungsoo | ko |
dc.date.accessioned | 2022-09-01T09:00:51Z | - |
dc.date.available | 2022-09-01T09:00:51Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/298245 | - |
dc.description.abstract | The present invention provides an apparatus and method for washing and concentrating microparticles encapsulated in microscale droplets using an acoustic radiation force. The apparatus includes: a piezoelectric substrate; a slanted finger interdigital transducer (SIDT) electrode deposited on the piezoelectric substrate and configured to generate surface acoustic waves under an AC signal applied thereto; and a microfluidic chip which is adhered to the piezoelectric substrate with being spaced apart from the SIDT electrode, has a microscale channel section formed therein, in which a single continuous phase and a plurality of dispersed phases are injected, respectively, and includes a plurality of inlet ports into which continuous and dispersed phases are injected, and a discharge port from which a plurality of droplets composed of the continuous and dispersed phases and generated by the intersection thereof are discharged. | - |
dc.title | Apparatus and method for washing and concentrating microparticles encapsulated in microscale droplets using acoustic radiation force | - |
dc.title.alternative | 음향 방사력을 이용한 마이크로 스케일 액적 내 입자의 세정 및 농축 장치와 방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Sung, Hyung Jin | - |
dc.contributor.localauthor | Cho, Yeunwoo | - |
dc.contributor.localauthor | Kim, Hyoungsoo | - |
dc.contributor.nonIdAuthor | Park, Jinsoo | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 16705847 | - |
dc.identifier.patentRegistrationNumber | 11369961 | - |
dc.date.application | 2019-12-06 | - |
dc.date.registration | 2022-06-28 | - |
dc.publisher.country | US | - |
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