CMP 공정에서의 웨이퍼와 패드사이 슬러리 유동의 수치모사Numerical simulation of the slurry flow between a wafer and a pad during CMP prcess
- Advisors
- 김도현researcher; Kim, Do-Hyunresearcher
- Description
- 한국과학기술원 : 화학공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2001
- Identifier
- 165463/325007 / 000993010
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 화학공학과, 2001.2, [ v, 70 p. ]
- Keywords
슬러리 유동; 화학-기계적 연마공정; 수치모사; Numerical simulation; slurry flow; Chemical Mechanical Polishing
- Appears in Collection
- CBE-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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