학위논문(석사) - 한국과학기술원 : 전기및전자공학부, 2021.8,[iii, 39 p. :]
Through Silicon Via (TSV)▼aSignal Integrity▼aDeep Neural Network (DNN)▼aPotential Defect▼a2.5D & 3D Package; 관통 실리콘 비아▼a신호 무결성▼a심층 신경망▼a잠재적인 불량▼a2.5차원 및 3차원 패키지
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