Modeling and analysis of ground integrity (GI) in power distribution network (PDN) of mobile systems and high bandwidth memory (HBM)모바일 시스템 및 고대역폭 메모리의 전력망에서 접지 무결성 모델링 및 분석

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 322
  • Download : 0
Conventionally, ground was defined as an equipotential point or plane that serves as a reference potential for a circuit and system. However, in high-speed digital systems, it is more appropriate to define ground as a low-impedance path for current to return to its source. With an emergence of recent technologies such as artificial intelligence and virtual reality, the demand for high data bandwidth and data rate digital systems is continually increasing. As the data rate increases, it becomes more challenging to keep ground integrity (GI) of a system. It is tough to maintaining the impedance of a return current path because parasitics of interconnection is seen at a high data rate. Therefore, modeling and analyzing GI of a system is needed. Among many electronic systems, this thesis took a time division multiple access (TDMA) mobile system and a high bandwidth memory (HBM) as systems of interest, where low-frequency GI and high frequency GI are important, respectively. For a TDMA mobile system, ground noise coupling paths from a TDMA power amplifier, which periodically switching at 217 Hz, to a noise-sensitive analog circuit need to be analyzed. Therefore, a ground resistance model which can quantitatively analyze the ground noise coupling paths on PCB and chassis of a mobile phone was proposed. Based on the proposed model, different designs of PCBs were analyzed. The analysis was experimentally verified by correlating the analysis and measured output noise of audio circuits. For HBM, ground noise coupling paths of simultaneously switching outputs (SSOs) need to be analyzed. Therefore, ground impedance models which can quantitatively and qualitatively analyze the ground noise coupling paths on PCB-package-interposer-chip hierarchical power distribution network (PDN) of HBM were proposed. Based on the proposed model, HBM PDNs with different ground configurations were analyzed. The analysis was verified by correlating the frequency domain impedance analysis and time domain eye diagram of SSOs. For evaluation of GI of HBM, a target impedance was proposed. Frequency-domain target ground noise was derived from time-domain undershoot specification of HBM I/O. Based on the proposed target impedance, GI of HBM was evaluated, and the evaluation was verified by showing whether the evaluated PDN satisfied the time-domain undershoot specification.
Advisors
Kim, Jounghoresearcher김정호researcher
Description
한국과학기술원 :전기및전자공학부,
Publisher
한국과학기술원
Issue Date
2021
Identifier
325007
Language
eng
Description

학위논문(박사) - 한국과학기술원 : 전기및전자공학부, 2021.2,[v, 61 p. :]

Keywords

Ground integrity▼aTDMA noise▼ahigh bandwidth mermoy▼asimultaneous switching output noise▼aHBM; 접지 무결성▼a시분할다중접속 잡음▼a고대역폭 메모리▼a동시스위칭 출력회로 잡음▼a접지 잡음

URI
http://hdl.handle.net/10203/295624
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=956682&flag=dissertation
Appears in Collection
EE-Theses_Ph.D.(박사논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0