DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jung, Youngho | ko |
dc.contributor.author | Bae, Sunghyun | ko |
dc.contributor.author | Kwon, Kyungmok | ko |
dc.contributor.author | Mitchell, Colin J. | ko |
dc.contributor.author | Khokhar, Ali Z. | ko |
dc.contributor.author | Reed, Graham T. | ko |
dc.contributor.author | Wilkinson, James S. | ko |
dc.contributor.author | Chung, Yun Chur | ko |
dc.contributor.author | Yu, Kyoungsik | ko |
dc.date.accessioned | 2022-04-14T06:49:30Z | - |
dc.date.available | 2022-04-14T06:49:30Z | - |
dc.date.created | 2022-01-04 | - |
dc.date.created | 2022-01-04 | - |
dc.date.created | 2022-01-04 | - |
dc.date.issued | 2022-03 | - |
dc.identifier.citation | LASER & PHOTONICS REVIEWS, v.16, no.3 | - |
dc.identifier.issn | 1863-8880 | - |
dc.identifier.uri | http://hdl.handle.net/10203/292799 | - |
dc.description.abstract | Light-induced manipulation techniques have been utilized to transport, trap, or levitate microscopic objects for a wide range of applications in biology, electronics, and photonics. Without making direct physical contact, they can provide simple yet powerful means for high-precision assembly of microscale functional blocks and components within the integrated circuit platforms, thereby offering a viable alternative to the conventional heterogeneous integration techniques, such as wafer/die bonding and transfer printing. Using a microbubble-based optofluidic pick-and-place assembly process, heterogeneous integration of compact III-V semiconductor photodetectors on a silicon-based photonic integrated circuit chip, enabling direct high-speed vertical electrical contacts for significantly improved photogenerated carrier transit distance/time, is experimentally demonstrated. The microdisk-shaped InGaAs p-i-n photodetector integrated on the silicon waveguide has a 3 dB bandwidth exceeding 50 GHz under the applied bias voltage of -1 V for near-infrared wavelengths around 1.55 mu m. The light-induced optofluidic assembly will provide a promising route for seamless heterogeneous integration of various optoelectronic components with high-speed and low-noise electrical interconnection on the fully processed silicon photonic/electronic integrated circuit platforms. | - |
dc.language | English | - |
dc.publisher | WILEY-V C H VERLAG GMBH | - |
dc.title | High-Bandwidth InGaAs Photodetectors Heterogeneously Integrated on Silicon Waveguides Using Optofluidic Assembly | - |
dc.type | Article | - |
dc.identifier.wosid | 000733263500001 | - |
dc.identifier.scopusid | 2-s2.0-85121593446 | - |
dc.type.rims | ART | - |
dc.citation.volume | 16 | - |
dc.citation.issue | 3 | - |
dc.citation.publicationname | LASER & PHOTONICS REVIEWS | - |
dc.identifier.doi | 10.1002/lpor.202100306 | - |
dc.contributor.localauthor | Chung, Yun Chur | - |
dc.contributor.localauthor | Yu, Kyoungsik | - |
dc.contributor.nonIdAuthor | Mitchell, Colin J. | - |
dc.contributor.nonIdAuthor | Khokhar, Ali Z. | - |
dc.contributor.nonIdAuthor | Reed, Graham T. | - |
dc.contributor.nonIdAuthor | Wilkinson, James S. | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | heterogeneous integration | - |
dc.subject.keywordAuthor | InGaAs photodetectors | - |
dc.subject.keywordAuthor | microbubble manipulation | - |
dc.subject.keywordPlus | LOW DARK CURRENT | - |
dc.subject.keywordPlus | PHOTODIODES | - |
dc.subject.keywordPlus | LASERS | - |
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