DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, Seungryong | ko |
dc.contributor.author | Park, Miran | ko |
dc.contributor.author | Lee, Hoyeon | ko |
dc.date.accessioned | 2022-02-16T06:42:02Z | - |
dc.date.available | 2022-02-16T06:42:02Z | - |
dc.identifier.uri | http://hdl.handle.net/10203/292227 | - |
dc.description.abstract | Disclosed are a method, an apparatus, and a system for inspecting a ball grid array-type semiconductor chip package. A first embodiment of the present invention provides an apparatus for inspecting a semiconductor chip package, the apparatus comprising: a first image acquisition unit for acquiring a reference image using a three-dimensional image of a semiconductor chip serving as a reference, the reference image being obtained by removing a region of interest from the three-dimensional image; a second image acquisition unit for acquiring a two-dimensional image of a semiconductor chip to be inspected; and an image processing unit for deriving an image of a region of interest of the semiconductor chip to be inspected, from the difference between the reference image and the two-dimensional image. | - |
dc.title | Method for inspecting ball grid array-type semiconductor chip package | - |
dc.title.alternative | 볼 그리드 어레이형 반도체 칩 패키지의 검사 방법 | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | Cho, Seungryong | - |
dc.contributor.nonIdAuthor | Lee, Hoyeon | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 16326340 | - |
dc.identifier.patentRegistrationNumber | 11150198 | - |
dc.date.application | 2017-10-18 | - |
dc.date.registration | 2021-10-19 | - |
dc.publisher.country | US | - |
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