DC Field | Value | Language |
---|---|---|
dc.contributor.author | Rhee, Hyun-Woo | ko |
dc.contributor.author | Shim, Joonsup | ko |
dc.contributor.author | Kim, Jae-Yong | ko |
dc.contributor.author | Bang, Juseong | ko |
dc.contributor.author | Yoon, Hyeonho | ko |
dc.contributor.author | Kim, Myeongho | ko |
dc.contributor.author | Kim, Chong Cook | ko |
dc.contributor.author | You, Jong-Bum | ko |
dc.contributor.author | Park, Hyo-Hoon | ko |
dc.date.accessioned | 2022-02-14T06:41:05Z | - |
dc.date.available | 2022-02-14T06:41:05Z | - |
dc.date.created | 2022-01-14 | - |
dc.date.created | 2022-01-14 | - |
dc.date.issued | 2022-02 | - |
dc.identifier.citation | OPTICS LETTERS, v.47, no.3, pp.714 - 717 | - |
dc.identifier.issn | 0146-9592 | - |
dc.identifier.uri | http://hdl.handle.net/10203/292218 | - |
dc.description.abstract | We developed an inter-chip optical link using direct optical wire (DOW) bonding by open-to-air polymerization. An arch-shaped wire was drawn from a tip in a similar way to a metal wire, but the wire was formed from a polymer solution that solidified in the air during wiring. The DOW bonding was examined for silicon photonic chips where grating couplers are integrated for input/output coupling. Cone-shaped studs were formed at the ends of the wire, and their geometry was optimized using finite-difference time-domain simulation to give a mode conversion function. Although the polymer wire had a multimode scale of 7 mu m, the wire bonding between the grating couplers showed a relatively low insertion loss of 5.8 dB at a wavelength of 1590 nm compared to a conventional connection using single-mode fiber blocks. It also showed a larger wavelength tolerance within the range of similar to 1520-1590nm. DOW bonding between a grating coupler and a single-mode fiber were also examined to verify the feasibility of out-of-plane connection with edge-coupling devices. The grating-to-fiber wire link also exhibited a large wavelength tolerance. (C) 2022 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement | - |
dc.language | English | - |
dc.publisher | OPTICAL SOC AMER | - |
dc.title | Direct optical wire bonding through open-to-air polymerization for silicon photonic chips | - |
dc.type | Article | - |
dc.identifier.wosid | 000749682500069 | - |
dc.identifier.scopusid | 2-s2.0-85123962780 | - |
dc.type.rims | ART | - |
dc.citation.volume | 47 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 714 | - |
dc.citation.endingpage | 717 | - |
dc.citation.publicationname | OPTICS LETTERS | - |
dc.identifier.doi | 10.1364/OL.445526 | - |
dc.contributor.localauthor | Park, Hyo-Hoon | - |
dc.contributor.nonIdAuthor | Bang, Juseong | - |
dc.contributor.nonIdAuthor | Kim, Myeongho | - |
dc.contributor.nonIdAuthor | Kim, Chong Cook | - |
dc.contributor.nonIdAuthor | You, Jong-Bum | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | CIRCUITS | - |
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