Universal stretchable electronic circuit board with hermetically sealed liquid metal interconnection and strain-controllable polymeric substrate

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dc.contributor.authorKim, Min Seongko
dc.contributor.authorChoi, Jungrakko
dc.contributor.authorLEE, YUNGko
dc.contributor.authorKim, Seonggiko
dc.contributor.authorBae, Byeong-Sooko
dc.contributor.authorLim, Hyuneuiko
dc.contributor.authorPark, Inkyuko
dc.date.accessioned2021-12-07T06:52:11Z-
dc.date.available2021-12-07T06:52:11Z-
dc.date.created2021-12-02-
dc.date.issued2021-11-
dc.identifier.citation6th International Conference on Advanced Electromaterials, ICAE 2021-
dc.identifier.urihttp://hdl.handle.net/10203/290172-
dc.languageEnglish-
dc.publisherKorean Institute of Electrical and Electronic Material Engineers-
dc.titleUniversal stretchable electronic circuit board with hermetically sealed liquid metal interconnection and strain-controllable polymeric substrate-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname6th International Conference on Advanced Electromaterials, ICAE 2021-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationRamada Plaza Hotel Jeju & Online-
dc.contributor.localauthorBae, Byeong-Soo-
dc.contributor.localauthorPark, Inkyu-
dc.contributor.nonIdAuthorKim, Seonggi-
dc.contributor.nonIdAuthorLim, Hyuneui-
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