DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Min Seong | ko |
dc.contributor.author | Choi, Jungrak | ko |
dc.contributor.author | LEE, YUNG | ko |
dc.contributor.author | Kim, Seonggi | ko |
dc.contributor.author | Bae, Byeong-Soo | ko |
dc.contributor.author | Lim, Hyuneui | ko |
dc.contributor.author | Park, Inkyu | ko |
dc.date.accessioned | 2021-12-07T06:52:11Z | - |
dc.date.available | 2021-12-07T06:52:11Z | - |
dc.date.created | 2021-12-02 | - |
dc.date.issued | 2021-11 | - |
dc.identifier.citation | 6th International Conference on Advanced Electromaterials, ICAE 2021 | - |
dc.identifier.uri | http://hdl.handle.net/10203/290172 | - |
dc.language | English | - |
dc.publisher | Korean Institute of Electrical and Electronic Material Engineers | - |
dc.title | Universal stretchable electronic circuit board with hermetically sealed liquid metal interconnection and strain-controllable polymeric substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 6th International Conference on Advanced Electromaterials, ICAE 2021 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Ramada Plaza Hotel Jeju & Online | - |
dc.contributor.localauthor | Bae, Byeong-Soo | - |
dc.contributor.localauthor | Park, Inkyu | - |
dc.contributor.nonIdAuthor | Kim, Seonggi | - |
dc.contributor.nonIdAuthor | Lim, Hyuneui | - |
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