Method of manufacturing anisotropic conductive film using vertical ultrasonic waves수직의 초음파를 사용하는 이방성 도전 필름을 제조하는 방법

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dc.contributor.authorPaik, Kyung-Wookko
dc.contributor.authorYoon, DalJinko
dc.contributor.authorLee, SangHoonko
dc.date.accessioned2021-11-16T06:43:47Z-
dc.date.available2021-11-16T06:43:47Z-
dc.identifier.urihttp://hdl.handle.net/10203/289169-
dc.description.abstractDisclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.-
dc.titleMethod of manufacturing anisotropic conductive film using vertical ultrasonic waves-
dc.title.alternative수직의 초음파를 사용하는 이방성 도전 필름을 제조하는 방법-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorYoon, DalJin-
dc.contributor.nonIdAuthorLee, SangHoon-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber15920261-
dc.identifier.patentRegistrationNumber11161988-
dc.date.application2018-03-13-
dc.date.registration2021-11-02-
dc.publisher.countryUS-
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