DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Yechan | ko |
dc.contributor.author | Koh, Seok-Tae | ko |
dc.contributor.author | Lee, Jeongeun | ko |
dc.contributor.author | Kim, Hongkyun | ko |
dc.contributor.author | Choi, Jaesuk | ko |
dc.contributor.author | Ha, Sohmyung | ko |
dc.contributor.author | Kim, Chul | ko |
dc.contributor.author | Je, Minkyu | ko |
dc.date.accessioned | 2021-11-02T06:48:35Z | - |
dc.date.available | 2021-11-02T06:48:35Z | - |
dc.date.created | 2021-10-26 | - |
dc.date.created | 2021-10-26 | - |
dc.date.issued | 2021-02 | - |
dc.identifier.citation | IEEE International Solid-State Circuits Conference (ISSCC), pp.472 - + | - |
dc.identifier.issn | 0193-6530 | - |
dc.identifier.uri | http://hdl.handle.net/10203/288572 | - |
dc.language | English | - |
dc.publisher | IEEE | - |
dc.title | A Frequency-Splitting-Based Wireless Power and Data Transfer IC for Neural Prostheses with Simultaneous 115mW Power and 2.5Mb/s Forward Data Delivery | - |
dc.type | Conference | - |
dc.identifier.wosid | 000662193600191 | - |
dc.identifier.scopusid | 2-s2.0-85102369200 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 472 | - |
dc.citation.endingpage | + | - |
dc.citation.publicationname | IEEE International Solid-State Circuits Conference (ISSCC) | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Francisco | - |
dc.identifier.doi | 10.1109/ISSCC42613.2021.9365781 | - |
dc.contributor.localauthor | Kim, Chul | - |
dc.contributor.localauthor | Je, Minkyu | - |
dc.contributor.nonIdAuthor | Park, Yechan | - |
dc.contributor.nonIdAuthor | Koh, Seok-Tae | - |
dc.contributor.nonIdAuthor | Lee, Jeongeun | - |
dc.contributor.nonIdAuthor | Kim, Hongkyun | - |
dc.contributor.nonIdAuthor | Choi, Jaesuk | - |
dc.contributor.nonIdAuthor | Ha, Sohmyung | - |
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