BendID: flexible interface for localized deformation recognition

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dc.contributor.authorNguyen, Vinh Pko
dc.contributor.authorYoon, Sang Hoko
dc.contributor.authorVerma, Anshko
dc.contributor.authorRamani, Karthikko
dc.date.accessioned2021-10-06T05:10:19Z-
dc.date.available2021-10-06T05:10:19Z-
dc.date.created2021-10-06-
dc.date.issued2014-09-13-
dc.identifier.citationUbiComp '14: The 2014 ACM Conference on Ubiquitous Computing, pp.553 - 557-
dc.identifier.urihttp://hdl.handle.net/10203/288055-
dc.description.abstractthe location, magnitude and direction of its deformation. We use BendID to provide users with a tactile metaphor for pressure based input. The device is constructed by layering an array of indium tin oxide (ITO)-coated PET film electrodes on a Polymethylsiloxane (PDMS) sheet, which is sandwiched between conductive foams. The pressure values that are interpreted from the ITO electrodes are classified using a Support Vector Machine (SVM) algorithm via the Weka library to identify the direction and location of bending. A polynomial regression model is also employed to estimate the overall magnitude of the pressure from the device. A model then maps these variables to a GUI to perform tasks. In this preliminary paper, we demonstrate this device by implementing it as an interface for 3D shape bending and a game controller.-
dc.languageEnglish-
dc.publisherACM SIGCHI AND SIGMOBILE-
dc.titleBendID: flexible interface for localized deformation recognition-
dc.typeConference-
dc.identifier.wosid000455940400055-
dc.identifier.scopusid2-s2.0-84908577244-
dc.type.rimsCONF-
dc.citation.beginningpage553-
dc.citation.endingpage557-
dc.citation.publicationnameUbiComp '14: The 2014 ACM Conference on Ubiquitous Computing-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSeattle-
dc.identifier.doi10.1145/2632048.2636092-
dc.contributor.localauthorYoon, Sang Ho-
dc.contributor.nonIdAuthorNguyen, Vinh P-
dc.contributor.nonIdAuthorVerma, Ansh-
dc.contributor.nonIdAuthorRamani, Karthik-
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