DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yi, Kiyoon | ko |
dc.contributor.author | Liu, Peipei | ko |
dc.contributor.author | Park, Seong-Hyun | ko |
dc.contributor.author | Sohn, Hoon | ko |
dc.date.accessioned | 2021-09-28T01:10:08Z | - |
dc.date.available | 2021-09-28T01:10:08Z | - |
dc.date.created | 2021-09-28 | - |
dc.date.created | 2021-09-28 | - |
dc.date.created | 2021-09-28 | - |
dc.date.issued | 2022-01 | - |
dc.identifier.citation | OPTICS AND LASERS IN ENGINEERING, v.148 | - |
dc.identifier.issn | 0143-8166 | - |
dc.identifier.uri | http://hdl.handle.net/10203/287889 | - |
dc.description.abstract | In this study, an ultrasound generation and sensing system using a femtosecond laser is developed specifically for noncontact inspection of a moving object. In the developed femtosecond laser ultrasonic system, a laser pulse source is divided into pump and probe laser pulses. Using a pump laser pulse with a subpicosecond duration, ultrasounds with ultrashort wavelengths (micrometer to tens of nanometers) are generated up to THz. Then, the resulting ultrasounds are measured using a probe laser pulse based on reflectometry at a sampling frequency of up to 1.5 THz. The developed system is used to generate and measure ultrasounds from a silicon wafer while the wafer is moving in a horizontal direction. Because of the ultrashort pulse duration of the probe and pump laser pulses, the contact time of these pluses with respect to a moving object is extremely short (subpicosecond), and the distortion of ultrasounds due to object motion is minimized. Ultrasounds are measured from the silicon wafer in both pulse-echo and pitch-catch modes, and it is validated that the ultrasounds acquired from a moving condition of the silicon wafer are in good agreement with those obtained from a stationary condition. Then, the thickness of a submicrometer coating layer deposited on the silicon wafer was successfully estimated while the silicon wafer was moving up to 20 mm/s. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.title | Femtosecond laser ultrasonic inspection of a moving object and its application to estimation of silicon wafer coating thickness | - |
dc.type | Article | - |
dc.identifier.wosid | 000696454500020 | - |
dc.identifier.scopusid | 2-s2.0-85113300929 | - |
dc.type.rims | ART | - |
dc.citation.volume | 148 | - |
dc.citation.publicationname | OPTICS AND LASERS IN ENGINEERING | - |
dc.identifier.doi | 10.1016/j.optlaseng.2021.106778 | - |
dc.contributor.localauthor | Sohn, Hoon | - |
dc.contributor.nonIdAuthor | Park, Seong-Hyun | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Femtosecond laser | - |
dc.subject.keywordAuthor | Ultrafast ultrasonic | - |
dc.subject.keywordAuthor | Reflectometry | - |
dc.subject.keywordAuthor | Moving object scanning | - |
dc.subject.keywordAuthor | Coating thickness estimation | - |
dc.subject.keywordAuthor | Silicon wafer | - |
dc.subject.keywordPlus | SURFACE BRILLOUIN-SCATTERING | - |
dc.subject.keywordPlus | FILMS | - |
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