Designing Metamaterial Cells to Enrich Thermoforming 3D Printed Object for Post-Print Modification

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dc.contributor.authorKo, Donghyeonko
dc.contributor.authorYim, Jee Binko
dc.contributor.authorLee, Yujinko
dc.contributor.authorPyun, Jaehoonko
dc.contributor.author이우훈ko
dc.date.accessioned2021-06-10T02:50:15Z-
dc.date.available2021-06-10T02:50:15Z-
dc.date.created2021-06-10-
dc.date.created2021-06-10-
dc.date.issued2021-05-13-
dc.identifier.citation2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths, CHI 2021-
dc.identifier.urihttp://hdl.handle.net/10203/285699-
dc.description.abstractIn this paper, we present a metamaterial structure called thermoformable cells, TF-Cells, to enrich thermoforming for post-print modification. So far, thermoforming is limitedly applied for modifying a 3D printed object due to its low thermal conductivity. TF-Cells consists of beam arrays that affluently pass hot air and have high heat transference. Through heating the embedded TF-Cells of the printed object, users can modify not only the deeper area of the object surface but also its form factor. With a series of technical experiments, we investigated TF-Cells’ thermoformability, depending on their structure’s parameters, orientations, and heating conditions. Next, we present a series of compound cells consisting of TF-Cells and solid structure to adjust stiffness or reduce undesirable shape deformation. Adapting the results from the experiments, we built a simple tool for embedding TF-Cells into a 3D model. Using the tool, we implemented examples under contexts of mechanical fitting, ergonomic fitting, and aesthetic tuning.-
dc.languageEnglish-
dc.publisherAssociation for Computing Machinery-
dc.titleDesigning Metamaterial Cells to Enrich Thermoforming 3D Printed Object for Post-Print Modification-
dc.typeConference-
dc.identifier.scopusid2-s2.0-85106679308-
dc.type.rimsCONF-
dc.citation.publicationname2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths, CHI 2021-
dc.identifier.conferencecountryJA-
dc.identifier.conferencelocationVirtual-
dc.identifier.doi10.1145/3411764.3445229-
dc.contributor.localauthor이우훈-
dc.contributor.nonIdAuthorYim, Jee Bin-
dc.contributor.nonIdAuthorLee, Yujin-
dc.contributor.nonIdAuthorPyun, Jaehoon-
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