(A) low crosstalk dielectric waveguide interface for high-speed chip-to-chip communication고속 칩투칩 통신을 위한 저간섭 유전체 도파관 인터페이스

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dc.contributor.advisorBae, Hyeon-Min-
dc.contributor.advisor배현민-
dc.contributor.authorSung, Hyun-Mo-
dc.date.accessioned2021-05-13T19:33:28Z-
dc.date.available2021-05-13T19:33:28Z-
dc.date.issued2020-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=911340&flag=dissertationen_US
dc.identifier.urihttp://hdl.handle.net/10203/284731-
dc.description학위논문(석사) - 한국과학기술원 : 전기및전자공학부, 2020.2,[iii, 21 p. :]-
dc.description.abstractTraditionally, wireline communication have consisted of two main types: conductor and optical communication. However, a new communication method that can be as cheap as conductors and capable of high-speed communication as optical communication is needed in the short-range communication market such as data centers. Dielectric waveguide-based data transmission (E-TUBE) is a next-generation wireline communication strategy for high-speed data communications, operated at 73GHz. However, new system architecture is required because high-speed data communication requires an operating frequency of 84GHz. In this present study, we demonstrated the antenna for 84GHz operating frequency, which satisfies the required performance for 56Gbps data communication. Also, in this thesis, we propose a large-area metal wall based shielding interface (WASI) to satisfy the required interference level for the system. The proposed solution that encloses the board shield not only interference in the dielectric, but also in the air. Proposed model shows that the interference can be effectively reduced in all bands compared with the conventional via-based shielding scheme. Therefore, these results clearly demonstrate that E-TUBE system is the next generation solution for high-speed communication.-
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectDielectric Waveguide▼aLow crosstalk▼aHigh-speed Chip-to-Chip communication▼aInterface▼aAntenna▼aMetal wall▼aShielding▼aNext Generation-
dc.subject유전체 도파관▼a저간섭▼a고속 칩투칩 통신▼a인터페이스▼a안테나▼a금속 격벽▼a차폐▼a차세대-
dc.title(A) low crosstalk dielectric waveguide interface for high-speed chip-to-chip communication-
dc.title.alternative고속 칩투칩 통신을 위한 저간섭 유전체 도파관 인터페이스-
dc.typeThesis(Master)-
dc.identifier.CNRN325007-
dc.description.department한국과학기술원 :전기및전자공학부,-
dc.contributor.alternativeauthor성현모-
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