Development of a nondestructive miniature X-ray system for the inspection of through silicon via in 3-dimensional stacked semi-conductor packaging3차원 적층형 반도체 패키징의 Through Silicon Via 결함 검사용 소형 X-선 비파괴검사장비 개발

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dc.contributor.advisorCho, Sung Oh-
dc.contributor.advisor조성오-
dc.contributor.authorKim, Hyun-Nam-
dc.date.accessioned2021-05-12T19:44:56Z-
dc.date.available2021-05-12T19:44:56Z-
dc.date.issued2020-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=924472&flag=dissertationen_US
dc.identifier.urihttp://hdl.handle.net/10203/284411-
dc.description학위논문(박사) - 한국과학기술원 : 원자력및양자공학과, 2020.8,[vi, 91 p. :]-
dc.description.abstractA new concept for a non-destructive testing device using a novel carbon nanotube (CNT) based miniature X-ray tube is proposed. The device can be used for small-scale internal inspection of objects. To investigate the effectiveness of the proposed concept, the device was fabricated and its performance was systematically analyzed. The non-destructive testing device consists of a CNT based miniature X-ray tube, a scintillator, an optical lens, and a detector. The size of the focal spot needed to identify objects as small as $5$ $\mu m$ was calculated through simulation. An electron optics simulation software, E-GUN, was used to optimize the geometries of both the focusing cup and the X-ray target to achieve the desired focal spot size of X-ray tube. CNT based miniature X-ray tube was fabricated using the brazing process and an NdFeB focusing lens was used to further reduce the focal spot size. XR images were obtained using the fabricated device and the spatial resolutions of the images were evaluated using the modulation transfer function. The fields of view (FOV) per probe are $7.1$ $mm^2$ and $1.8$ $mm^2$ when using a 5x optical lens and a 10x optical lens, respectively. The FOV can be increased by increasing the number of probes incorporated into the device. MTF10 values were determined to be $105$ $lp/mm$ and $230$ $lp/mm$ when using 5x optical lens and 10x optical lens, respectively. By using an optical lens to enlarge the XR images, the effect of focal spot was minimized and clear XR images were obtained. The fabricated non-destructive testing device exhibits sufficient capability to effectively inspect the internal components of objects.-
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectX-ray Radiography▼aCarbon Nano Tube▼aX-ray Tube▼aScintillator▼aThrough Silicon Via-
dc.subject엑스선 촬영▼a탄소나노튜브▼a엑스선관▼a신틸레이터▼a실리콘관통전극-
dc.titleDevelopment of a nondestructive miniature X-ray system for the inspection of through silicon via in 3-dimensional stacked semi-conductor packaging-
dc.title.alternative3차원 적층형 반도체 패키징의 Through Silicon Via 결함 검사용 소형 X-선 비파괴검사장비 개발-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN325007-
dc.description.department한국과학기술원 :원자력및양자공학과,-
dc.contributor.alternativeauthor김현남-
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