Design of optic components for efficient beam steering and coupling in optical phased arrays and interconnection systems

Abstract

In the last decades, silicon photonics technology is rapidly being applied not only to computers and other electronic and communication devices, but also to all areas that control and utilize optical signals. Silicon photonics technology uses standard silicon that is compatible with existing silicon semiconductor technology. It refers to a technology for processing/ delivering information by using an optical signal inside a silicon chips, between chips, or outside the chip. In this paper, we presented the problems and improvements in the optical phase array and optical connection technology, which are the application fields of silicon photonics technology, and implemented and tested the proposed method. The optical phased array is a key component of LiDAR (Light detection and ranging) that can acquire 2D images and depth information using light. It is being actively researched because of the advantages of lowering power consumption, miniaturization, and improving durability by replacing the existing mechanical method. In this paper, we propose two types of two-dimensional scanning. First, it is a method of integrating a plurality of one-dimensional phased array having a vertical radiation angle. The transversal angle of each one-dimensional phase radiator is determined through phase control as in the conventional method. The longitudinal angle is determined by selecting the corresponding one-dimensional phased array. Secondly, the vertical and horizontal scanning is possible by controlling only the wavelength after phase initialization. Compared to the conventional channel-based phase control, the control element can be significantly reduced. In another study of phased arrays. By combining an external lens with the End-Fire OPA, the wide vertical radiation angle is significantly reduced, increasing vertical resolution and increasing light intensity. Optical connection technology is a field that is being rapidly researched as a means of overcoming the limitations of electrical connection. Optical connection technology supports high-speed communication because the available bandwidth is wider than electrical connection. No interference and small size of the optical waveguide enables high integration. In this paper, we proposed and implemented a new method using parabolic mirror as one of the optical technologies for chip-to-chip connection and compared with using SMF. In addition, optical connection technology using a parabolic mirror was applied to a printed circuit board to fabricate and test an optical fiber embedded OPCB.