DC Field | Value | Language |
---|---|---|
dc.contributor.author | 강수민 | ko |
dc.contributor.author | 김택수 | ko |
dc.date.accessioned | 2021-02-04T04:50:10Z | - |
dc.date.available | 2021-02-04T04:50:10Z | - |
dc.date.created | 2020-11-30 | - |
dc.date.created | 2020-11-30 | - |
dc.date.created | 2020-11-30 | - |
dc.date.created | 2020-11-30 | - |
dc.date.created | 2020-11-30 | - |
dc.date.issued | 2020-09 | - |
dc.identifier.citation | 마이크로전자 및 패키징학회지, v.27, no.3, pp.9 - 20 | - |
dc.identifier.issn | 1226-9360 | - |
dc.identifier.uri | http://hdl.handle.net/10203/280566 | - |
dc.description.abstract | Transferring of functional nanofilms onto target substrates is a cornerstone to developing nanofilm-based nextgeneration applications. In this work, we provide a brief review of recent advances on nanofilm transfer methods by categorizing them into the following three methods: wet-etching transfer, electrochemical delamination, and mechanical transfer. Furthermore, the mechanical transfer method, which is regarded as a promising technology owing to its facile, substrate recyclable, and widely applicable process, is overviewed by focusing on fracture mechanics approaches. Finally, the perspectives and challenges for future development of the mechanical transfer method are discussed. | - |
dc.language | Korean | - |
dc.publisher | 한국마이크로전자및패키징학회 | - |
dc.title | 나노박막 전사 방법 및 계면 파괴 역학 | - |
dc.title.alternative | Nanofilm Transfer Methods and Interfacial Fracture Mechanics | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 27 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 9 | - |
dc.citation.endingpage | 20 | - |
dc.citation.publicationname | 마이크로전자 및 패키징학회지 | - |
dc.identifier.doi | 10.6117/kmeps.2020.27.3.009 | - |
dc.identifier.kciid | ART002637462 | - |
dc.contributor.localauthor | 김택수 | - |
dc.description.isOpenAccess | Y | - |
dc.subject.keywordAuthor | Nanofilm | - |
dc.subject.keywordAuthor | Transfer | - |
dc.subject.keywordAuthor | Adhesion | - |
dc.subject.keywordAuthor | Crack driving force | - |
dc.subject.keywordAuthor | Crack deflection | - |
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