Enhanced Current Drivability of CVD Graphene Interconnect in Oxygen-Deficient Environment

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dc.contributor.authorKang, Chang Gooko
dc.contributor.authorLee, Sang Kyungko
dc.contributor.authorLee, Young Gonko
dc.contributor.authorHwang, Hyeon Junko
dc.contributor.authorCho, Chunhumko
dc.contributor.authorLim, Sung Kwanko
dc.contributor.authorHeo, Jinseongko
dc.contributor.authorChung, Hyun-Jongko
dc.contributor.authorYang, Heejunko
dc.contributor.authorSeo, Sunaeko
dc.contributor.authorLee, Byoung Hunko
dc.date.accessioned2021-01-28T06:14:54Z-
dc.date.available2021-01-28T06:14:54Z-
dc.date.created2021-01-26-
dc.date.created2021-01-26-
dc.date.issued2011-11-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v.32, no.11, pp.1591 - 1593-
dc.identifier.issn0741-3106-
dc.identifier.urihttp://hdl.handle.net/10203/280247-
dc.description.abstractGraphene has been considered as a candidate for interconnect metal due to its high carrier mobility and current drivability. In this letter, the breakdown mechanism of single-layer chemical-vapor-deposited (CVD) graphene and triple-layer CVD graphene has been investigated at three different conditions (air exposed, vacuum, and dielectric capped) to identify a failure mechanism. In vacuum, both single-and triple-layer graphenes demonstrated a breakdown current density as high as similar to 10(8) A/cm(2), which is similar to that of exfoliated graphene. On the other hand, the breakdown current of graphene exposed to air was degraded by one order of magnitude from that of graphene tested in vacuum. Thus, oxidation initiated at the defect sites of CVD graphene was suggested as a major failure mechanism in air, while Joule heating was more dominant with dielectric capping and in vacuum.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleEnhanced Current Drivability of CVD Graphene Interconnect in Oxygen-Deficient Environment-
dc.typeArticle-
dc.identifier.wosid000296239500041-
dc.identifier.scopusid2-s2.0-80054977743-
dc.type.rimsART-
dc.citation.volume32-
dc.citation.issue11-
dc.citation.beginningpage1591-
dc.citation.endingpage1593-
dc.citation.publicationnameIEEE ELECTRON DEVICE LETTERS-
dc.identifier.doi10.1109/LED.2011.2166240-
dc.contributor.localauthorYang, Heejun-
dc.contributor.nonIdAuthorKang, Chang Goo-
dc.contributor.nonIdAuthorLee, Sang Kyung-
dc.contributor.nonIdAuthorLee, Young Gon-
dc.contributor.nonIdAuthorHwang, Hyeon Jun-
dc.contributor.nonIdAuthorCho, Chunhum-
dc.contributor.nonIdAuthorLim, Sung Kwan-
dc.contributor.nonIdAuthorHeo, Jinseong-
dc.contributor.nonIdAuthorChung, Hyun-Jong-
dc.contributor.nonIdAuthorSeo, Sunae-
dc.contributor.nonIdAuthorLee, Byoung Hun-
dc.description.isOpenAccessN-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorBreakdown-
dc.subject.keywordAuthorcurrent density-
dc.subject.keywordAuthorfailure mechanism-
dc.subject.keywordAuthorgraphene-
dc.subject.keywordAuthorinterconnect-
dc.subject.keywordPlusNANORIBBON-
dc.subject.keywordPlusNANOTUBE-
dc.subject.keywordPlusFILMS-
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