Coating thickness estimation in silicon wafer using ultrafast ultrasonic measurement

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Considering the diminishing dimensions of modern silicon wafers (50-100 µm thick and their coating layers are in an nm scale) and potential defect sizes, spatial resolutions for the corresponding non-destructive evaluation (NDE) solutions should be in the order of sub-µm or nm. However, the spatial resolutions of current NDE techniques are often in the range of µm or mm. In this study, an ultrafast ultrasonic measurement system is developed using a femtosecond pulse laser. The proposed ultrafast ultrasonic measurement system can generate ultrasonic waves up to several THz (10
Publisher
SPIE
Issue Date
2020-04-22
Language
English
Citation

Health Monitoring of Structural and Biological Systems IX 2020

ISSN
0277-786X
DOI
10.1117/12.2558380
URI
http://hdl.handle.net/10203/280180
Appears in Collection
CE-Conference Papers(학술회의논문)
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